TECHNACOL can work on any project requiring bonding engineering skills.
We deal with all aspects of bonfing assembly :
- drawing-up specifications- standards and bibliography research- assembly design, choice of material and numerical simulation of the bonded joint- characterisation of materials used- selection of adhesives- definition and validation of suitable surface treatments - characterisation of bonded assemblies before and after ageing (accelerated and natural)- industrialisation studies (choice of materials or design of specific devices, preparation of the production ranges)- first or small series production- production process testing- in-company technology transfer
Technology transfer is organised on an individual basis.
TECHNACOL is involved in research on bonding themes, in collaboration with industry and other laboratories.